Getting Started with CAM
How to prepare and submit a clean PCB data package for CAM processing, from Gerber and ODB++ exports to fabrication notes and netlists.
A clean data package is the fastest path to a first-pass build. This guide walks through what to include and how to structure it so CAM processing can start without a round of back-and-forth.
Choose a format
Export either extended Gerber (RS-274X) or ODB++. ODB++ is preferred because it carries the netlist, stackup, and component data in one intelligent database, reducing ambiguity.
What to include
- Copper layers — all signal and plane layers, correctly numbered top to bottom.
- Solder mask and paste — for each side.
- Silkscreen / legend — clipped off pads.
- Drill files — plated and non-plated, with an NC drill map.
- Board outline / rout — on a dedicated layer.
- Netlist — IPC-D-356 if exporting Gerber.
Fabrication notes
Your notes tell CAM how to build the board. At minimum, specify:
| Note | Example |
|---|---|
| Material | FR-4 Tg170, or specified laminate |
| Finished thickness | 1.6 mm |
| Copper weight | 1 oz outer, 0.5 oz inner |
| Surface finish | ENIG |
| Impedance | Per stackup, ±10% |
| IPC class | Class 2 or 3 |
Submit and review
Zip the layers, drill, netlist, and notes together with a stackup drawing. On receipt we normalize the data, extract a netlist from the copper, and run a DFM check against the target fab.
Once the package is verified, you receive an annotated DFM report to accept, waive, or fix before we release tooling.
Related terms
Have a board that fits this chapter?
Send us the design and constraints — an engineer returns first-pass DFM findings, usually within hours.