DFM & DRC Analysis

DFM analysis closes the gap between what a layout tool will happily route and what a fabricator can actually etch, drill, and plate with acceptable yield. We run your data against the target fab's real capability deck, not a generic ruleset.

Copper and spacing checks

• Trace width and spacing — flagging features below the fab's etch-compensated minimum, accounting for copper weight and line-loss.
• Acute angles and slivers — sharp copper slivers and acid traps that under-etch or lift.
• Hanging and isolated copper — dangling traces, orphaned pours, and antenna stubs that create RF and plating problems.

Drill and annular ring

Insufficient annular ring is the single most common cause of drill breakout. We verify pad-to-hole registration across worst-case layer misalignment and highlight tangency and breakout risks per IPC-2221 Class 2/3.

Solder mask and legend

We audit solder mask clearances and web widths, mask slivers between fine-pitch pads, and silkscreen encroachment onto pads that would compromise assembly.

Every violation is delivered as an annotated report keyed to layer and coordinate, so your team can accept, waive, or fix each item deliberately before we release to CAM tooling.